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JG-1103 Ablation and fire resistant bonded silicon resin
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Product description
1、Structure
2、Main technical index
Item |
Indexes |
Appearance |
Colorless or yellowish translucent liquid without mechanical impurities |
Viscosity (25℃) |
8000~13000 |
Residues (%) |
≥65 |
3、performance
This product is a type of resin with highly crosslinked structure. After curing, it has high hardness and can easily integrate with inorganic substance. It shows high heat resistance. When the temperature reaches glass transition temperature (800℃), there are more residues which are bonded through Si-O key and Si-C key. Therefore, it still shows higher cohesiveness in high temperatures.
4、purpose
This product is an ideal high-temperature hard adhesive that is used as refractory adhesive, high temperature adhesive, and high temperature sealant. It is mainly applicable to pressing metal smelting water gap and magnesia carbon brick and to pressing high-hardness mica plate and glass fiber board.
5、Packaging and transportation
To be packed in 200 kg iron bucket and stored in a dry, cool and well-ventilated place below 30℃. Keep it away from direct sunlight and heat source. The storage period is over 6 months and the product shall be shipped as dangerous goods.
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JG-1102 Silicon resin specially for bonding mica
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